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General information
Type    CPU / Microprocessor
Frequency (MHz)     200
Bus speed (MHz)       66
Clock multiplier       3
Package    296-pin Staggered Ceramic Pin Grid Array, 1.95″ x 1.95″ (4.95 cm x 4.95 cm)
Socket    Socket 7
Introduction date    13-Oct-97
Price at introduction    $135

Architecture / Microarchitecture
Manufacturing process    0.35 micron 4-layer metal CMOS technology
5.4 million transistors
Die size    88 mm2 mm2
Data width    32 bit
Floating Point Unit    Integrated
Level 1 cache size       32 KB 2-way set associative code cache
32 KB 2-way set associative data cache
Physical memory (GB)    4
Pipeline    5-stage with additional instruction translation stage
Multiprocessing    Not supported
Features    MMX technology
Low power features

* STOP CLOCK state
* STOP GRANT state
* STOP CLOCK SNOOP state
* AUTOHALT state
* Dynamic power management — MMX and FPU units, and some other circuits are powered down when not in use

Electrical/Thermal parameters
Min/Recommended/Max V core (V)    3.45 / 3.52 / 3.6
Minimum/Maximum operating temperature (°C)       0 — 60
Minimum/Maximum power dissipation (W)      3.5 (Stop Clock mode) / 13